Esprit: Promoting the industrialization of domestic MOCVD equipment
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A paper announcement of the dry photo optoelectronics announced that the online use rate of domestic MOCVD equipment has finally achieved zero breakthrough, which can be regarded as an important milestone in the LED industry's most advanced equipment.
According to an exclusive interview with Gao Guang LED reporters by senior leaders of Beijing Esprit Semiconductor Equipment Co., Ltd. (hereinafter referred to as “Espritâ€), “Chinese people will soon realize large-scale industrialization once they master key technologies. I have full confidence to realize the industrialization of domestic MOCVD."
Despite this, the first mass-produced domestic MOCVD developed by Esprit has always maintained a low-key style. “It is not advisable to over-render now, or wait for customers to come up with detailed test data results.†The executive stressed that “we are tying Solidly and down-to-earth, in order to have a place in China's high-end semiconductor equipment, it can make a breakthrough in the high-end semiconductor equipment industry."
Domestic MOCVD breakthrough
MOCVD is the key equipment for epitaxial wafer growth in the core of LED, and it is also the largest single investment in manufacturing. At present, there are a limited number of MOCVD equipment manufacturers that can provide industrial mass production in the world, and the manufacturers are mainly in Germany, the United States and Japan. Driven by the rapid development of the global LED industry, MOCVD has been in a state of tight supply in recent years.
Before Esprit, there was no domestic company that could actually mass-produce MOCVD equipment. Of course, there is no shortage of research institutes or enterprises in the research and development stage of MOCVD equipment.
At the beginning of this year, Tianlong Optoelectronics Co., Ltd., a domestic listed company, announced that it has signed a contract with Huasheng Optoelectronics Co., Ltd. to establish a Sino-foreign joint venture company with independent legal entities in Changzhou, mainly engaged in R&D, production, sales and after-sales service of MOCVD equipment and epitaxial processes. At one time, it became a hot spot of market attention.
However, the road to localization of MOCVD equipment in China has not gone smoothly. It can only produce small MOCVD equipment for scientific research. At present, there is no MOCVD equipment manufacturer that can provide mature industrial production, but recently there are several domestic equipment research and The company gave a timetable for the localization of equipment.
For example, the Institute of Semiconductors of the Chinese Academy of Sciences, the cooperation between Zhaoxin Group and Huazhong University of Science and Technology, Qingdao Jiesheng Optoelectronics and Xi'an University of Electronic Science and Technology, but in the end all fell short, and most of them will not be able to launch the prototype. In January 2010, the Zhaoxin Group's MOCVD prototype was once in the LED industry, but it ended up in the final.
In 2008, the founder of Esprit, with the mentality of “as long as it is artificial, the Chinese can do itâ€, and “if I can’t surpass the international MOCVD manufacturer, I will not do MOCVD equipmentâ€, I will start with Japanese designers communicated until 2010 when the two sides began to have formal cooperation intentions. In July 2010, Esprit and Hong Kong's investment partners began the development phase of MOCVD equipment.
Throughout the development process, General Manager of Xiangzhao Optoelectronics Wang Xiangwu and the company's technical team were invited to participate in the MOCVD design. According to the announcement issued on October 20th, Ganzhao Optoelectronics participated in the installation of auxiliary equipment such as exhaust gas treatment equipment, toxic gas detection and alarm, gas secondary piping, H2 and N2 primary, and final purifier. In less than a year, the first domestic MOCVD equipment developed by Esprit was shipped to the factory of Ganzhao Optoelectronics. For the design and prototype assembly of the equipment that can be completed in such a short period of time, Esprit said , “The direct participation of the extension production company is very important.â€
As the first company to participate in the design and introduction of localized MOCVD, Wang Xiangwu confessed to the high-tech LED reporter, "If you have money, you can buy imported cars. If you have no money, you can buy domestic cars. Whether it is domestic or foreign, as long as it is conducive to production, This is not necessarily the case. In other words, regardless of the white cat and the black cat, catching the mouse is a good cat. Regarding the prospects of localized MOCVD equipment, Wang Xiangwu said that he is very optimistic. 
What is Via In Pad? In shortly,via in pad is the via holes are at the SMD pad.The vias are very small,usually under 0.3mm.Why and how? First is there is no enough space to layout,you have to put the vias and holes closer even together.Second it helps thermal management and for high frequency boards,it may help improve signals.
Because the SMD pads are for SMD components loading,so the solder can not flow to inner layer or the other side when assemble.That is the most important for via in pad board.
How PCB manufacturers like us to do via in pad board? We will fill all vias with non-conductive epoxy and plate copper over it ,so the vias are flat same as others. Many PCB factories are unable to do such capability.
The key technology is how we fill vias and guarantee there is no any solder (surface finishing) in the holes.
Filled via in pad is a way to achieve intermediate density with an intermediate cost compared to using blind/buried vias. Some of the key advantages associated with using the via in pad technology are:
.Fan out fine pitch (less than .75mm) BGAs
.Meets closely packed placement requirements
.Better thermal management
.Overcomes high speed design issues and constraints i.e. low inductance
.No via plugging is required at component locations
.Provides a flat, coplanar surface for component attachment
Via in big pads are not a big problem.but for BGA,that is technology.As BGA pads are very small,10mil or 12mil,and there is no enough space.Manufacturing is not easy as other boards.