Packaging materials profiteering is no longer flipping technology matures to promote the transformation of material manufacturers
A small safety part in an automobile electrical device or piece of machinery that causes it to stop working if the electric current is too high, and so prevents fires or other dangers. Fuse, also known as current fuse, is defined by the IEC127 standard as "fuse-link". It is mainly an overload protection. If the fuse is properly installed in the circuit, the fuse will cut off the current and protect the circuit safe operation when the current abnormal is raised to a certain height and heat. Invented by Edison fuse is used to protect more than one hundred years ago when the expensive incandescent bulbs, along with the development of The Times, the fuse protection power equipment is not trained in current overheat damage, avoid electronic equipment serious damage caused by internal fault. When a circuit breaks down or is abnormal, the current increases with the current and the increased current may damage some important components in the circuit, and it may also burn the circuit and even cause a fire. If correctly placed in the circuit fuse, the fuse will be abnormal current increases to a certain height and heat, its own fuse to cut off the current, so as to protect the safe operation of the circuit.
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In addition, the changes in the packaging market pattern have also affected the expectations of material manufacturers to the market to a large extent. Some manufacturers are looking for ways to break through the market dilemma and find new profit growth points.
In particular, the new packaging technology is becoming more and more mature, and some material manufacturers are beginning to transform their packaging.
“At the same time as the supply of packaging materials, we also began to supply light source products.†Qian Xuexing, general manager of Shenzhen Chenri Technology Co., Ltd. (hereinafter referred to as “Crystal Technologyâ€) said in an interview.
Qian Xuexing said that with the company's previous advantages in solid crystal solder paste, under the opportunity of the maturity of flip-chip technology, the sales of accessories in the morning, especially the sales of flip-chip materials such as solid crystal solder paste, last year. At the same time, Qian Xuexing also wants to take the opportunity to extend to the downstream light source market.
Zhang Hongbiao, director of the High-tech LED Industry Research Institute (GLII), said that the packaging materials manufacturers that had been in the past few years have experienced a sharp decline in the price of packaged devices in recent years.
According to the survey data of the High-tech LED Industry Research Institute (GLII), the gross profit margin of most mainland LED packaging silicone companies can remain above 60% before and after 2011, and the packaging materials were once crowned as “high profitsâ€.
An industry analyst also said that in the past few years, the days of packaging materials companies have been nourished. Regardless of the profit of other links, the packaging materials factory can maintain a gross profit of no less than 40%-50%. “Some workshop-style factories in Zhongshan can purchase 516 kilograms of goods through regular channels when they buy 5,201 kilograms from regular manufacturers. The high profits are obvious, but nowadays, the scenery is no longer, packaging materials. The profit fell seriously."
The above analysts believe that this year's downstream lighting market should be the most optimistic period in history. Some small and medium-sized manufacturers with corresponding advantages will also be more involved in the terminal lighting market, trying to find new opportunities.
Qian Xuexing said that not all packaging materials manufacturers can smoothly transform, and the morning technology transformation flip-chip light source also depends on its own basic advantages.
Taking die-cast solder paste as an example, the die-bonding solder paste binds the flip chip to the pedestal to fix and conduct electricity. In the emerging flip-chip process, this is the key packaging material; in addition, due to the packaging material manufacturer It is necessary to have a good understanding of the packaging process and technical processes, which is also an advantage that can be extended to the downstream transformation in the morning.
At present, the capacity of flip-chip light source in the morning has reached a monthly capacity of about 3KK.
Zhang Hongbiao believes that the downstream lighting market is gradually opening up. As a midstream package that is most affected by upstream and downstream, the market changes are most uncertain this year, and this will also cause a large variation in the supply chain system of midstream packaging manufacturers. For material manufacturers, it is more common to take advantage of the opportunity to transform.
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