BYD Lighting launched the 'fine. Ming' series of high performance lamps
American Seagate China Factory HDI is the English abbreviation for High Density Interconnector. High-density interconnect (HDI) manufacturing is one of the fastest growing areas in the printed circuit board industry. From the first 32-bit computer from HP in 1985 to the large client server with 36 sequential multi-layer printed boards and stacked micro-vias, HDI/mini via technology is undoubtedly the future PCB architecture. Smaller ASICs and FPGAs with smaller device spacing, I/O pins, and embedded passives have shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, which drives Strong demand for HDI/mini vias. Buried Hole Pcb,Blind Hole Pcb,Buried Blind Hole Pcb,Multilayer Blind Buried Hole Pcb Chuangying Electronics Co.,Ltd , https://www.cwpcb.com
1. Light efficiency up to 135lm/W.
2. The PF value is 0.97.
3. High pressure resistance up to 4KV.
4. Product life is up to 40,000 hours.
5.40,000 hours or 10 years long warranty.
6. Can be widely used in office, factory, warehouse and other environments. name Fine Ming series model T8 H1 (18W) T8 H1 (15W) T8 H1 (10W) size Φ26*1212mm Φ26*1212mm Φ26*602mm power 18W 15W 10W Luminous flux 2450lm 1800lm 1200lm Color temperature 5700K 5700K 5700K Voltage 100-277V AC 100-277V AC 100-277V AC
Application case display
For details, please consult the order hotline.
HDI process
First-order process: 1+N+1
Second-order process: 2+N+2
Third-order process: 3+N+3
Fourth-order process: 4+N+4