CSP, automotive lighting, packaging materials manufacturers, betting new generation products
Silicon material manufacturer Toray Dow Corning has introduced a film-like sealing material for LED CSP (Chip Scale Package) and optical components widely used in automotive headlamps. At present, some products in these two fields are put into practical use, and it is expected that the market size of these two fields will expand in the future. According to some surveys, in 2015, the proportion of LED lighting and fixture products in Japan was 75%, while only 27.5% in the world. Toray Dow Corning expects that LED demand will continue to expand in the future. In terms of LED components, the output power per package has been increased from 0.2 W to 1 to 2 W, and the package mounting area of ​​the original 6 mm × 3 mm has also been reduced to 3 mm × 3 mm. In order to achieve a size of 1.2 mm × 1.2 mm and further miniaturization, various manufacturers have turned their attention to the CSP. The original LED element (top) and CSP type LED components (bottom). CSP can be greatly miniaturized. Most of the original LED elements are provided with a chip on a bath-shaped molding made of an organic material, and then a liquid silicon material containing a fluorescent agent is injected and heated to be hardened to perform sealing. On the other hand, the CSP is bonded to a ceramic substrate or the like in a wafer or the like, sealed with a film-like silicon material containing a fluorescent agent, and subjected to dicing. This not only enables miniaturization, but also reduces the total manufacturing cost and eliminates organic materials that cause a decrease in brightness. Toray for this purpose, Toray Dow Corning has developed a silicon material for film-like seals with high refractive index, high transparency, high hardness and LED chip protection, and can also produce ultra-thin products with a thickness of only 100 μm. According to the company, the material is also used to implement uniform packaging of multi-chip components with multiple chips using thin films. “CSP-type LEDs currently only account for a few percentage points in the market, and they are still in their infancy†(Tosakawa Koshi, Director of Group 1 of Product Development Department of Dongli Dao Kangning R&D Department). Due to the drastic changes in manufacturing processes and the need to implement equipment investments, the transition is slow. However, its market size is bound to expand in the future, so the company has been working in this area. Example of uniformly sealing multi-chip components with a film-like silicon sealing material containing a fluorescent agent Another area in which Toray Dow Corning is developing is the optical structural components for automotive applications such as automotive headlights. Organic materials such as polycarbonate and PMMA (acrylic resin, polymethyl acrylate resin) are generally used for this purpose, but silicon has characteristics such as high heat resistance, light resistance, flexibility, and durability as compared with these materials. Moreover, the resin itself is very soft, so that the complicated shape can be easily taken out from the mold when the part is molded, and the design freedom is high. Prototype example of optical structural members. Since the machine member can be demoulded and demolded, the structural design can be easily implemented on the inside. Prototype example of optical structural members. It is also easy to manufacture parts that are thick and thin at the same time. In order to achieve the above-mentioned use, Toray Dow Corning has developed a silicon material that can make the life and cleaning frequency of the mold equal to that of the conventional organic materials, and the moldability is better. This material has been widely used in general lighting fixtures, and it has also been successfully adopted in high-end cars in Europe because it can easily achieve highly creative designs. Magnetic Pod Vape,Disposable Pod Vapes,Ceramic Vape Pod,Pod Vape Pen ALD GROUP LIMITED , https://www.aldvapor.com
