STMicroelectronics and IBM jointly develop semiconductor manufacturing processes
Recently, STMicroelectronics and IBM signed a technical cooperation agreement, the two sides will jointly develop the next-generation semiconductor manufacturing process, jointly develop the design of 32nm, 22nm CMOS processing technology and 300mm silicon wafer manufacturing technology.
The agreement covers the development, design implementation and advanced technology research for 32mm and 22nm complementary metal oxide semiconductor (CMOS) technologies. In addition, the agreement includes the core bulk CMOS process and value-added derivative system-on-chip (SoC) technology of the two companies in the field of technology development. Under the agreement, ST and IBM will collaborate on the development of IP modules and platforms to accelerate the design speed of system-on-chip devices using these technologies.
As part of the cooperation agreement, the two parties will also set up a technology development team in the other company. STMicroelectronics will set up a bulk CMOS technology development team at IBM's semiconductor R&D center in East Fishkill and Albany, New York. IBM will set up a research and development team at the STMicroelectronics 300mm chip development and manufacturing center in Crolles, France. The two companies will collaborate to develop various value-added derivative technologies such as embedded memory and analog/RF devices. These technologies are widely used in consumer electronics, server markets, and wireless applications such as cell phones and global positioning systems.
In addition, STMicroelectronics will join an IBM CMOS technology alliance of semiconductor manufacturers, developers, and technology companies, and IBM has joined the Crolles2 alliance between STMicroelectronics and Freescale. By participating in an open system of resource sharing among members, technology alliance companies can increase the speed of innovation, reduce related costs, and better cope with the severe challenges of fast and low-cost semiconductor products.
"Considering IBM's extraordinary performance in developing advanced semiconductor technologies, we believe that this collaborative project will provide both parties with the expertise and technical solutions needed to overcome these technical challenges and ensure the time-to-market for both competitive products. "Italian Semiconductor's executive vice president of process technology and manufacturing activities, Laurent Bosson said. John E. Kelly III, senior vice president of research and development at IBM, said, "Join Semiconductor's participation in the IBM Technology Alliance has enabled us to further enhance our ability to solve the technical and economic problems inherent in the semiconductor industry's development of advanced technologies. We and STMicroelectronics The technology sharing and development cooperation will help to improve the development of manufacturing processes, while also giving customers shorter time-to-market and greater technical benefits."
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