OSRAM is responsible for coordinating the BMBF project to develop high-brightness infrared laser sources

January 31, 2020

As part of the “Integrated Microphotonics Technology” initiative, OSRAM Opto Semiconductors coordinates the work of the IMOTHEB (High Brightness Diode Laser Integrated Micro-Optics and Micro-Hot Components) project. The IMOTHEB project aims to improve the performance of laser systems and reduce production costs.

OSRAM Opto Semiconductors has set the goal of increasing semiconductor-level integration, thereby greatly increasing the brightness of infrared laser diodes. Thus, the micro-optical and micro-thermal components will be directly integrated into the wafer. While maintaining the same high emission quality during the project, it is expected to increase the optimal value of light output by 40%. If higher light output is achieved, the laser die will be an ideal component for fiber laser pump modules and fiber coupled diode lasers.

The project was launched on October 1, 2012 and will continue until September 30, 2015. OSRAM Opto Semiconductors is responsible for the coordination of the project and provides its expertise in semiconductors, laser diodes and laser rods; the simulation is subcontracted to the Fraunhofer Institute for Applied Optics and Precision Engineering (Fraunhofer Institute) For Applied Optics and Precision Engineering).

Flex-Rigid PCB, it's the PCB that part of it is rigid and part of it is flex. It combine flex PCB and rigid PCB in a same PCB together and we call it flex-rigid PCB or rigid-flex PCB. Normally, the rigid PCB area is for soldering electronic components and the flex PCB area would be taken as cables to connect rigid PCB areas together, this could make the rigid-flex PCB perfectly suit for a wide range of applications.

 

PCB = printed circuit board and PCBA = printed circuit board assembly. For PCB, it means the copper circuits be printed on a board, and so the main composition of PCB are copper and board.

 

The copper is the circuits material and the circuits designed by the PCB designers. Depends on the current in the circuits, the PCB copper thickness could be done with 0.5oz-10oz. But the PCB designers need be noted that the copper track width/space need be enlarged with the thickness. For example, the minimum copper track width/space could be 3mil/3mil with 0.5oz, but would be 4mil/4mil with 1oz.

 

The PCB board could be rigid PCB, could be flex PCB and also could be flex-rigid PCB. And the materials could be FR4, PI, Aluminum, Copper-based, Rogers, Teflon, etc. They have different applications. For example, FR4 PCB is the most commonly used for rigid PCB and almost good for all electronics products; PI is the most commonly used for flex PCB; Aluminum and copper-based have good thermal diffusivity and always used for LED PCB ; Rogers PCB and Teflon PCB are always used for High Frequency PCB, etc.

 

We are the one-stop shop for all kinds of PCB manufacture service from PCB Prototype to big volume, which could save our customers a lot of time and money.

 

PCB Manufacture Capabilities

 

Features 

 Capabilities

Layers

1-36 layers

Material

 FR-4, Aluminum, Copper, Polyimide, high frequency (Rogers, PTEE, PI), etc.

PCB Type

FR-4 Standard PCB , Aluminum PCB , Copper-based PCB, HDI PCB , Rigid-Flex PCB, Flex PCB, Thick Copper PCB and Rogers PCB, etc.

Board Thickness

0.1mm-6.0mm

Copper Thickness

1/2oz-6oz(18um-210um)

Biggest Board size

600mm*1200mm

Min Tracing/Spacing

0.075mm/0.075mm (3mil/3mil)

Min drilling Hole diameter

0.15mm(6mil), 0.1mm(4mil)-laser drill

Solder Mask

Green, Black, White, Red, Yellow, Blue and Purple, etc.

Silkscreen color

White, Blue, Black, Red, Yellow

Surface finish

HASL Lead free, Immersion Gold (ENIG), Immersion Tin, Immersion Silver, OSP, Carbon oil, etc.

Special Techniques

Impedance Control, Gold Fingers, Blind/Buried vias, Peelable solder mask, Half holes, Via-in-Pad and Countersink hole, etc.


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